Thermal Evaporation System
Thermal Evaporation System
제품 특징
- Feature
- Process : Thin films deposition
- Deposition matrial : Meterials(Al, Zn, Cu, Au)
- Deposition thickness : Customer specified
- Purpose : Research and development
제품 자료
다운로드 가능한 자료가 없습니다.
제품 상세 정보
| 항목 | 값 |
|---|---|
| connector | No |
| managed | No |
| overview order | 1 |
| product order | 1 |
| product spec | Feature
● Process : Thin films deposition ● Deposition matrial : Meterials(Al, Zn, Cu, Au) ● Deposition thickness : Customer specified ● Purpose : Research and development Deposition Method ● Thermal evaporation ● Metal film : Tungsten filament tpye ● Substrate holder rotation : variable size sample mounting available Performance ● Base Pressure : 1 X 10^(-7)Toor ● Throughput : single wafer process ● Substrate heating uniformity : ≤±5% Source Power Supply Unit ● AC power supply : provides constant power output ● Output : switching type ● Output : 5V X 300A ● Size : Full-rack(19'') wide ● Analog current limit control on front panel Boat Type ● Tungsten(W), Molybdenum(Mo), Tantalum(Ta) ● Dimension(40-50(L) X 8-20(W) X 1.7-2.5(D)mm) ● Various Size(Order Made) Crucible Type ● Heat Shielded Crucible Heater(Max. 1,800°C) ● Crucible : Alumina, Quartz, BN, Ta, Mo, C ● Various Type and Size |
| quantity | 0 |
| reg date | 2017-02-27 11:17:19 |
| single | No |