PVD
총 4개 제품
상위 분류: Vacuum System
Evaporator
E-Beam Evaporation System
Film DepositionProcess : Multi-layer films depositionDeposition material : Al, Ti, Ta, Ni, Au, PtSubstrate size : 4''~12'' diameterPurpose : Research and development
Pulsed Laser Deposotion
Pulsed Laser Deposotion System
Maximum substrate size : Can handle one 2-inch diameter substrate, or multiple small substrates per customer requirementMaximum substrate temperature : 950°C(in oxygen) for non-transparent substrates such as Silicon, and 850°C for transparent substrates(such as LaAlO3)Temperature uniformity : ± 3°C across 2-inch diameter Si substrate
Sputter
Sputtering System
Process Chamber Method : Depo-down(planar type)Base pressure : 110^(-7)Cathode 3 inch internal type : 3 sets.Substrate holder : Max. size is 2 inch 3ea(Rotation:30rpm) 3 step position control
Thermal Evaporation System
Thermal Evaporation System
FeatureProcess : Thin films depositionDeposition matrial : Meterials(Al, Zn, Cu, Au)Deposition thickness : Customer specifiedPurpose : Research and development
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